Integrated circuit having doped semiconductor body and method

ABSTRACT

An integrated circuit and method for making an integrated circuit including doping a semiconductor body is disclosed. One embodiment provides defect-correlated donors and/or acceptors. The defects required for this are produced by electron irradiation of the semiconductor body. Form defect-correlated donors and/or acceptors with elements or element compounds are introduced into the semiconductor body.

CROSS-REFERENCE TO RELATED APPLICATIONS

This Utility Patent Application claims priority to German PatentApplication No. DE 10 2006 055 885.5 filed on Nov. 27, 2007, which isincorporated herein by reference.

BACKGROUND

One or more embodiments relate to a method for making an integratedcircuit including doping a semiconductor body and an integrated circuithaving a doped semiconductor body.

By doping a semiconductor body, semiconductor zones of differentconductivity types, i.e. pn junctions, can be formed therein. Amultiplicity of semiconductor components such as MOSFETs (Metal OxideSemiconductor Field Effect Transistors), bipolar transistors, IGBTs(Insulated Gate Bipolar Transistors), thyristors or else diodes can thusbe realized. For semiconductor components having reverse voltages in therange of a few 100 V to a few kV or a few 10 kV, on the one hand lowdopant concentrations of the starting material are desirable, but on theother hand they should also be realized with suitable homogeneity inorder to obtain specified reliability of the respective semiconductorcomponent or else a required yield during the production of therespective semiconductor component of the integrated circuit. Therefore,a method for doping a semiconductor body which enables favorableproperties with regard to the homogeneity of a dopant concentrationobtainable thereby is desirable.

For these and other reasons, there is a need for the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of embodiments and are incorporated in and constitute apart of this specification. The drawings illustrate embodiments andtogether with the description serve to explain principles ofembodiments. Other embodiments and many of the intended advantages ofembodiments will be readily appreciated as they become better understoodby reference to the following detailed description. The elements of thedrawings are not necessarily to scale relative to each other. Likereference numerals designate corresponding similar parts.

FIG. 1A to 1C illustrates schematic cross-sectional views during aprocess stage in accordance with embodiments for making an integratedcircuit including doping a semiconductor body.

FIGS. 2A to 2C illustrate schematic cross-sectional views of a furtherprocess stage in accordance with embodiments for doping a semiconductorbody.

FIGS. 3A and 3B illustrate schematic dopant concentration profiles of asemiconductor body which can be obtained with embodiments of thisinvention.

FIG. 4 illustrates a schematic cross-sectional view of a superjunctiontransistor structure.

FIG. 5 illustrates schematic profiles of the electric field during theoperation of the superjunction structure.

DETAILED DESCRIPTION

In the following Detailed Description, reference is made to theaccompanying drawings, which form a part hereof, and in which is shownby way of illustration specific embodiments in which the invention maybe practiced. In this regard, directional terminology, such as “top,”“bottom,” “front,” “back,” “leading,” “trailing,” etc., is used withreference to the orientation of the Figure(s) being described. Becausecomponents of embodiments can be positioned in a number of differentorientations, the directional terminology is used for purposes ofillustration and is in no way limiting. It is to be understood thatother embodiments may be utilized and structural or logical changes maybe made without departing from the scope of the present invention. Thefollowing detailed description, therefore, is not to be taken in alimiting sense, and the scope of the present invention is defined by theappended claims.

It is to be understood that the features of the various exemplaryembodiments described herein may be combined with each other, unlessspecifically noted otherwise.

One embodiment provides a method for making an integrated circuitincluding doping a semiconductor body including irradiation of thesemiconductor body with electrons in order to produce defects therein,introduction of an element or element compound forming defect-correlateddonors and/or acceptors into the semiconductor body and activation ofthe defect-correlated donors and/or acceptors.

The semiconductor body can be a semiconductor wafer, for example. Thewafer may already have been subjected to further processes, e.g., in thecontext of forming a semiconductor component, before the irradiationwith electrons. The irradiation of the semiconductor body with electronsis effected for example in such a way that the defects generated therebyare distributed as homogenously as possible in the semiconductor body.For this purpose, for instance the energy of the electron beam can becoordinated with the range dependant on the material of thesemiconductor body. The defects produced in the semiconductor body canbe for instance vacancies, e.g., vacancies in a silicon lattice. Thevacancies can form vacancy complexes or else complexes with otherdefects present in the semiconductor wafer. In this case, an irradiationof the semiconductor body with electrons can be effected over onesurface of the semiconductor body or else sequentially over oppositesurfaces of the semiconductor body. Through a suitable choice ofelectron dose and electron energy, it is possible to obtain anadvantageous vertical homogeneity of the defects required for formingthe defect-correlated donors and/or acceptors.

In one embodiment, the activation of the defect-correlated donors and/oracceptors is effected during the introduction of the element or elementcompound forming defect-correlated donors and/or acceptors by thesemiconductor body being heated.

In a further embodiment, the activation of the defect-correlated donorsand/or acceptors is effected using a process of thermal annealing of thesemiconductor body subsequent to the introduction of the element orelement compound.

In a further embodiment, the irradiation of the semiconductor body withelectrons is effected before the introduction of the element or elementcompound forming defect-correlated donors and/or acceptors. Thisembodiment then affords advantages for example if the introduction ofthe elements or element compounds forming defect-correlated donorsand/or acceptors can be effected more homogenously in the case wheredefects are already present in the semiconductor body, e.g., using anintensified diffusion on account of the defects.

In a further embodiment, the irradiation of the semiconductor body withelectrons is effected after the introduction of the element or elementcompound forming defect-correlated donors and/or acceptors. Such anembodiment then affords advantages for example if the elements orelement compounds forming the defect-correlated donors and/or acceptorsdiffuse to a greater extent in a low-defect semiconductor body than in adefect-rich semiconductor body, since an advantageous homogeneity of theelements or element compounds in the semiconductor body can then beobtained. If hydrogen, for example, is chosen for forminghydrogen-correlated donors in a silicon lattice to which vacancies havebeen added, then it is possible, when the hydrogen is introduced intothe silicon lattice with a subsequent irradiation of the silicon crystalwith electrons, to obtain a faster distribution of the hydrogen in thesilicon since atomic hydrogen diffuses more rapidly in low-defectsilicon than in defect-rich silicon.

In a further embodiment, the introduction of the element or elementcompound forming defect-correlated donors and/or acceptors is effectedby at least one of the methods plasma treatment, heat treatment anddiffusion from a solid source. In the case of a plasma treatment, theelement or the element compound is introduced into the semiconductorbody via a plasma. In the case of the heat treatment, the element or theelement compound is present in gaseous form in an atmosphere surroundingthe semiconductor body and is introduced into the semiconductor body viathe gas phase. In the case of diffusion from a solid source, a solidcontaining the element or element compound is applied to thesemiconductor body and a diffusion of the element or element compoundfrom the solid into the semiconductor body is effected using a thermalprocess.

In a further embodiment, an electron-shielding mask is applied to thesemiconductor body before the irradiation with electrons in order toobtain a local irradiation. The defects can thereby be produced in adefined manner in specific regions of the semiconductor body.Consequently, it is possible to obtain for example a local doping bydefect-correlated donors or acceptors in the semiconductor body.

In a further embodiment, after the introduction of an element or elementcompound forming defect-correlated donors and/or acceptors, a process ofetching and cleaning of at least the surface over which the element orelement compound was introduced is effected. It is thereby possible forexample to remove defects at the surface of the semiconductor body whichwere produced during the introduction of the element or elements, e.g.,plasma damage at the surface or the remaining solid source from whichthe element or element compound was introduced into the semiconductorbody.

In a further embodiment, a temperature and/or duration during thethermal annealing of the semiconductor body are/is kept so low thatdefects produced in the semiconductor body remain for reducing aminority carrier lifetime. This embodiment thus enables a combineddoping and setting of the minority carrier lifetime. Temperaturestypical for this lie in the range of between 200° C. and 400° C.

In a further embodiment, the element introduced into the semiconductorbody corresponds to at least one of the elements hydrogen and nitrogen.The semiconductor body can be for example a semiconductor body composedof silicon. Hydrogen forms defect-correlated donors in silicon, whereinthe defects are produced as homogenously as possible for instance in theform of vacancies in the silicon lattice by electron irradiation of thesemiconductor body given a suitable choice of the irradiationconditions.

In a further embodiment, a basic dopant concentration of thesemiconductor body is chosen to be less than 5×10¹⁴ cm⁻³ and, in yetanother embodiment, less than 1×10¹⁴ cm⁻³. The term basic dopantconcentration herein denotes the dopant concentration of a semiconductorwafer into which doped semiconductor zones can be formed for thedefinition of semiconductor components in additional, for examplepreviously performed processes. Such a low dopant concentration insilicon is suitable for example for forming components having highreverse voltages in the range of a few 100 V to a few 10 kV. In the caseof such low dopant concentrations, a doping using defect-correlateddonors and/or acceptors on the basis of the defects produced usingelectron irradiation enables a very homogenous dopant concentration.This has a favorable effect both on the reliability of the componentsproduced thereby and on the process yield.

In accordance with a further embodiment, irradiation with electrons iseffected with doses in the range of 0.1 to 500 kGy. The irradiation withelectrons can be effected for example in an energy range of 4 MeV to 20MeV. Although the dose range and energy range specified herein, forexample for silicon as semiconductor body, afford suitable preconditionsfor doping with defect-correlated donors and/or acceptors, furthersemiconductor materials which deviate from Si and which have differentabsorption properties with regard to electron irradiation can adopt doseand energy ranges deviating therefrom.

In accordance with a further embodiment, the thermal annealing iseffected at temperatures in the range of 220° C. to 550° C. over a timeperiod in the range of 15 min to 20 h.

Besides silicon, the semiconductor body can for example also be formedfrom gallium arsenide. It goes without saying that materials deviatingtherefrom can also be used for the semiconductor body provided thatdefect-correlated donors and/or acceptors can be produced in thematerials.

A further embodiment of a method for doping a semiconductor bodycomposed of silicon including the features of irradiation of thesemiconductor body with electrons in order to produce defects therein,introduction of hydrogen into the semiconductor body and activation ofthe defect-correlated donors and/or acceptors.

In one embodiment, the activation is effected during the introduction ofthe element or element compound forming the defect-correlated donorsand/or acceptors or during a thermal annealing process in thesemiconductor body.

A further embodiment relates to a method for making an integratedcircuit including correcting a dopant concentration in a semiconductorbody during the formation of an integrated circuit including thefeatures of performing at least those processes for forming theintegrated circuit which require a higher temperature in comparison witha temperature during the thermal annealing of the semiconductor body forforming the defect-correlated donors and/or acceptors, raising and/orlowering the net doping concentration in the semiconductor body usingdefect-correlated donors and/or acceptors, and completing the integratedcircuit. It is thereby possible for example to raise a basic dopantconcentration in the semiconductor body or else a dopant concentrationwithin further semiconductor zones in the semiconductor body. By way ofexample, this may involve for instance a CoolMOS structure(superjunction or compensation component), in which, using an electronirradiation in conjunction with a hydrogen plasma treatment, it ispossible to homogenously raise the dopant concentration of the nconductivity type within the n-conductive regions of the compensationstructure and to reduce the effectively active dopant concentration ofthe p conductivity type in the p-conductive regions of the compensationstructure. It is thereby possible for example to alter a loading in atargeted manner in the direction of a higher dopant concentration of then conductivity type.

In accordance with a further embodiment, the correction of the dopantconcentration can be carried out only in parts of the semiconductorbody. For this purpose, for instance a mask impermeable to electrons canbe applied to the semiconductor substrate, after which the semiconductorbody can be irradiated with electrons in order to produce defects. Themask can be formed for example as a metal screen having a suitablethickness.

In a further embodiment, the correction of the dopant concentration isperformed multiply in succession. Consequently, irradiation withelectrons, introduction of elements or element compounds formingdefect-correlated donors and/or acceptors, and a thermal annealing forforming the defect-correlated donors and/or acceptors are performedmultiply in succession. Independently of the number of correction steps,that is to say also in the case of a single correction process, it ispossible to determine a required additional dopant concentration andhence process parameters such as, for instance, the electron irradiationdose by characterizing measurements (e.g., a breakdown voltagemeasurement) on the components or test structures.

The integrated circuit can include, for example, a diode, a bipolartransistor, a MOS transistor, an IGBT or a thyristor. It goes withoutsaying that structures deviating therefrom, such as diffusion resistors,for instance, can also be realized.

A further embodiment specifies an integrated circuit includingsemiconductor zones which are formed within a semiconductor body anddefine the integrated circuit, electrical connection/driving structuresformed outside the semiconductor body, wherein a basic dopantconcentration within the semiconductor body is determined bydefect-correlated donors and/or acceptors. The semiconductor zones canbe for example doped well zones with the aid of which e.g., source anddrain of a MOS transistor, anode and cathode for a diode or elseemitter, base and collector of a bipolar transistor are formed. Theelectrical connection/driving structures can be for instancemetallization layers which are insulated from one another but which canbe electrically connected, using vias, to one another and to a surfaceof the semiconductor body for making contact with the integratedcircuit. Moreover, the connection/driving structures can also includegate insulation structures and gate electrodes in order for instance tocontrol a channel conductivity of a MOS transistor. The basic dopantconcentration within the semiconductor body can be for example thedopant concentration of a semiconductor component that defines theblocking strength and hence the voltage class of the component.

A further embodiment provides an integrated circuit includingsemiconductor zones which are formed within a semiconductor body anddefine the integrated circuit;

electrical connection/driving structures formed outside thesemiconductor body, wherein a dopant concentration within at least oneof the semiconductor zones is determined by defect-correlated donorsand/or acceptors.

A further embodiment relates to an integrated circuit includingsemiconductor zones which are formed within a semiconductor bodycomposed of silicon and define the integrated circuit, electricalconnection/driving structures formed outside the semiconductor body,wherein a basic dopant concentration of the n conductivity type withinthe semiconductor body is determined by hydrogen-correlated donors.

A further embodiment provides an integrated circuit includingsemiconductor zones which are formed within a semiconductor bodycomposed of silicon and define the integrated circuit, electricalconnection/driving structures formed outside the semiconductor body,wherein a dopant concentration within at least one of the semiconductorzones of the n conductivity type is determined by hydrogen-correlateddonors.

In accordance with a further embodiment, a shortest connection—passingthrough the at least one of the semiconductor zones—between a front sideand a rear side of the semiconductor body only runs through thosefurther semiconductor zones which have a higher dopant concentration incomparison with the at least one of the semiconductor zones. If forexample a cross-sectional view of the semiconductor body is considered,therefore, then further semiconductor zones lying above the at least onesemiconductor zone and also below the latter have a comparatively higherdopant concentration with respect to the at least one of thesemiconductor zones. The dopant concentration defined by thedefect-correlated donors and/or acceptors in the at least onesemiconductor zone therefore represents the lowest dopant concentrationalong such a connecting line from the front side to the rear side of thesemiconductor body. The further semiconductor zones can represent forexample semiconductor zones whose concentration profile of the dopantsis determined by implantation or else diffusion from a solid source.

A further embodiment relates to an integrated circuit includingsemiconductor zones which are formed within a semiconductor body anddefine the integrated circuit, electrical connection/driving structuresformed outside the semiconductor body, wherein at least one of thesemiconductor zones contains a superjunction structure and a dopantconcentration within the superjunction structure is at least partlydetermined by defect-correlated donors and/or acceptors.

The integrated circuit can include for example a diode, a bipolartransistor, a MOS transistor, a superjunction transistor, an IGBT or athyristor.

The views illustrated in the following figures serve for illustratingembodiments and are not represented in a manner true to scale. In theviews, similar or corresponding elements are provided with the samereference identifications. The process stages illustrated in FIGS. 1A to1C illustrate embodiments for irradiating a semiconductor body withelectrons in order to produce defects in the semiconductor body. Itshould be pointed out that the embodiments for doping a semiconductorbody are assigned not only the method feature for producing defects byelectron irradiation as illustrated in FIGS. 1A to 1C but also furthermethod features such as the introduction of an element or elementcompound forming defect-correlated donors and/or acceptors into thesemiconductor body as well as a thermal annealing of the semiconductorbody for forming the defect-correlated donors and/or acceptors. One orboth of these further method features will be discussed for example inFIGS. 2A to 2C and the figure description thereof. It should be pointedout that the method features described with the aid of the figures ofirradiation of the semiconductor body with electrons and alsointroduction of an element or element compound forming defect-correlateddonors and/or acceptors can be performed in any desired order, that isto say that irradiation by electrons can thereby be effected after orbefore the introduction of the element or element compound formingdefect-correlated donors and/or acceptors. Likewise, the method fordoping the semiconductor body can be performed multiply in succession inorder for example to gradually approach a desired dopant concentrationmore and more precisely.

FIG. 1A illustrates a schematic view during one process stage of amethod for doping a semiconductor body in accordance with oneembodiment. In this case, a semiconductor body 1, which may be forexample a semiconductor wafer that has not yet been preprocessed or hasalready been preprocessed, is irradiated with electrons 3 over a surface2 of the semiconductor body 1. This irradiation is intended to producedefects in the semiconductor body 1, with the aid of whichdefect-correlated donors and/or acceptors are formed in later processstages. In the irradiation an energy of the electrons 3 is chosen forexample in such a way that defects having a defect concentration that isas homogenous as possible are thereby produced within the semiconductorbody 1. The semiconductor body 1 can optionally be turned over afterthis irradiation, after which a renewed irradiation with electrons 3 mayensue. The electrons then firstly impinge on the surface 4, into thesemiconductor body 1 and produce defects therein, after which thedefects emerge from the semiconductor body 1 again via the surface 2.This optional renewed irradiation over the opposite surface can be usedfor example if an electron energy on which the irradiation is basedwould lead to a profile of the defect concentration from one surface tothe other which, upon renewed irradiation from the opposite surface, hasa favorable effect with regard to the homogeneity of the defectconcentration that can thereby be obtained in the vertical waferdirection.

FIG. 1B illustrates a schematic illustration of a process stage of amethod for doping a semiconductor body in accordance with a furtherembodiment. In this case, a mask 5 is applied on the semiconductor body1 on the surface 2 before the irradiation with electrons 3, the materialand thickness of the mask being chosen suitably in order to prevent theelectrons 3 from penetrating into the semiconductor body 1.Consequently, during the irradiation of the surface 2, the electrons 3penetrate into the semiconductor body 1 only in the regions 6 notcovered by the mask 5.

Consequently, this embodiment enables a local irradiation of thesemiconductor body 1 and hence a production of defects in selectedregions 7 spaced apart laterally with respect to one another. It goeswithout saying that this electron irradiation can also be followed by aturning of the semiconductor body 1 with renewed electron irradiationfrom the opposite side.

FIG. 1C illustrates a schematic view of a process stage of a method fordoping a semiconductor body in accordance with a further embodiment. Inthis case, a plurality of semiconductor bodies 1, 1′ and 1″ are stackedone above another. This is followed by irradiation with electrons 3 inorder to produce the defects within the semiconductor bodies 1, 1′ and1″. It should be pointed out that the number of semiconductor bodiesstacked one above another need in no way amount to three, but rather canbe chosen as desired taking account of a range that can be obtained withthe chosen electron energy in the material of the semiconductor bodies1, 1′ and 1″. The irradiation with electrons can likewise be performedrepeatedly in succession, in which case a rearrangement of the stacksequence of the semiconductor bodies can ensue between the individualirradiations. Likewise, this embodiment can also be based on the use ofa mask as illustrated in the process stage of FIG. 1B for obtaining alocal irradiation with electrons.

The process stages illustrated in FIGS. 2A to 2C serve for introducingan element or element compound forming defect-correlated donors and/oracceptors into the semiconductor body 1. It should be pointed out thatthis process stage can either precede or succeed the process stage forirradiating the semiconductor body with electrons as illustrated inFIGS. 1A to 1C. Optionally, the thermal annealing of the semiconductorbody for forming the defect-correlated donors and/or acceptors can becarried out in the process chambers illustrated in FIGS. 2A to 2C. It isalso possible to carry out the thermal annealing of the semiconductorbody in a process chamber different from the process chamber forintroducing the elements or element compounds.

FIG. 2A illustrates a schematic view of a process stage of a method fordoping a semiconductor body in accordance with a further embodiment. Theschematically illustrated process stage relates to the introduction ofan element or element compound forming defect-correlated donors and/oracceptors into the semiconductor body 1. For this purpose, a plasmatreatment is effected within a plasma chamber 8, into which the gasesserving for igniting the plasma can be fed via a gas/vacuum system 9. Inthis case, the element or element compound forming the defect-correlateddonors and/or acceptors is also passed initially in gaseous form, e.g.,in a suitable gaseous compound, into the plasma chamber 8, where theelement or element compound is liberated after the ignition of theplasma between two electrodes E1 and E2 and penetrates into thesemiconductor body 1, which lies for instance on one of the electrodesE1, E2 serving as carrier. By way of example, it is possible to regulatethe temperature in the plasma chamber 8, such that a thermal annealingof the semiconductor body 1 for forming the defect-correlated donorsand/or acceptors can also be carried out within the plasma chamber. Theplasma can be a hydrogen plasma, for example, which serves forintroducing hydrogen into a semiconductor body composed of silicon inorder to form hydrogen-correlated donors. The hydrogen plasma treatmenttakes place for example at temperatures of between 250° C. and 500° C.over a time period of 15 min to 150 min.

FIG. 2B illustrates a schematic view of a process stage of a method fordoping a semiconductor body in accordance with a further embodiment. Asalready described in connection with FIG. 2A, this method feature alsorelates to the introduction of the element or element compound formingdefect-correlated donors and/or acceptors into the semiconductor body 1.For this purpose, a solid source 10 containing the element or elementcompound to be introduced is applied to the semiconductor body 1. Thesemiconductor body 1 with the applied solid source 10 is subjected to aheat treatment, e.g., within a heating chamber 11, wherein the elementor element compound contained in the solid source 10 escapes using thisheat treatment and is introduced into the semiconductor body 1.Consequently, the solid source 10 is distinguished by the fact that theelement or element compound which is contained in it and which issuitable for forming defect-correlated donors and/or acceptors escapesfrom the solid source during heating. In the case of a semiconductorbody composed of silicon into which hydrogen is intended to beintroduced, the solid source 10 used may be an amorphous silicon nitridelayer, for example, which is deposited for instance using plasmaenhanced chemical vapor deposition (PECVD) onto the semiconductor body 1at temperatures of a few 100° C., e.g., 400° C. The silicon nitridedeposited thereby has a very high hydrogen content, such that thehydrogen can be diffused from the silicon nitride layer into the siliconusing a subsequent heat treatment process.

FIG. 2C illustrates a schematic view of a process stage of a method fordoping a semiconductor body in accordance with a further embodiment. Asalready explained on the basis of the schematic views in FIGS. 2A and2B, this process stage also relates to the introduction of an element orelement compound forming defect-correlated donors and/or acceptors intothe semiconductor body. In this case, the element or element compound isintroduced using a heat treatment in a chamber 12, into which a gascontaining the element or element compound in a suitable form isintroduced via the gas/vacuum system 9, from where the element orelement compound, in the case of a suitable temperature increase,penetrates into the semiconductor body 1 via a surface thereof. By wayof example, hydrogen mixed with nitrogen gas, e.g., forming gas with aproportion of hydrogen of 20%, or nitrogen gas with an even higherproportion of hydrogen can be used for introducing hydrogen into thesilicon.

FIG. 3A illustrates a schematic diagram of a profile of the dopantconcentration N between opposite surfaces of a semiconductor body (i.e.into the depth) in accordance with one embodiment (e.g., along thesectional line A-A′ from FIG. 1A). In this case, the dopantconcentration N is homogenous in the region having the lowest dopantconcentration 13. In the region 13, the dopant concentration N isdefined by defect-correlated donors and/or acceptors which are formedfor example on the basis of the process stages illustrated in FIGS.1A-1C and 2A-2C. Further regions having a higher dopant concentration14, 14′ serve for example for defining a semiconductor component. Thefurther regions having a higher dopant concentration can be produced forinstance by ion implantation before the formation of the region 13. Theregions 14, 13, 14′ define for example body zone, drift zone andcollector zone of a vertical MOS transistor.

FIG. 3B illustrates a schematic diagram of a profile of the dopantconcentration N between opposite surfaces of a semiconductor body inaccordance with a further embodiment. In this case, the semiconductorbody 1 has a homogenous dopant concentration N. The region having thelowest dopant concentration 13, which is formed using defect-correlateddonors and/or acceptors, in this case includes the entire semiconductorbody 1. In this embodiment, the doping using defect-correlated donorsand/or acceptors is effected before the processing of the semiconductorbody 1 for forming semiconductor components. This embodiment can betaken as a basis for example for a semiconductor process in which theprocesses for forming a component proceed at such low temperatures thatthe previously introduced defect-correlated donors and/or acceptors arenot impaired inappropriately by the later processes, e.g., bydissociation. This embodiment may be suitable for instance for forming aSchottky diode.

FIG. 4 illustrates a schematic cross-sectional view of a superjunctiontransistor structure. Semiconductor zones 13, 14 and 14′ are defined ina semiconductor body 1, wherein connection/driving structures 16, 16′make contact with the substrate from opposite surfaces. Theconnection/driving structure 16 includes for example metallizationlayers, contact plugs and also a gate electrode for controlling achannel conductivity in the semiconductor substrate (only outlinedschematically in FIG. 4). The semiconductor zone 14 includes for examplebody and source regions (only outlined schematically in FIG. 4). Asuperjunction structure 15 in the form of laterally adjacentsemiconductor regions having alternate conductivity types, i.e. n typeand p type, is formed in the semiconductor zone 13. Moreover, betweenthe superjunction structure 15 and the semiconductor zone 14′ there maybe arranged a for example only n-doped semiconductor zone 13′ in thesemiconductor zone 13. The semiconductor zone 14′ has a comparativelyhigher dopant concentration in comparison with the semiconductor zone 13and is formed between the semiconductor zone 13 and the rear-sideconnection/driving structure 16′. The superjunction structure 15 and thesemiconductor zone 13′ represent the region having the lowest dopantconcentration, which region can be corrected with regard to the dopantconcentration by defect-correlated donors and/or acceptors. If thesuperjunction transistor is formed from silicon, for example, and ifhydrogen-correlated donors are used for correcting the dopantconcentration of the superjunction structure, it is thereby possible tolower the net doping concentration of the p-doped regions of thesuperjunction structure 15 and to increase the net doping concentrationof the n-doped semiconductor regions of the superjunction structure 15.

FIG. 5 illustrates by way of example a schematic illustration of theelectric field against a depth of the superjunction structure 15 duringoperation. In this case, the electric field is illustrated from thesemiconductor zone 14 through the semiconductor zone 13 to thesemiconductor zone 14′. The rear-side reduction of the electric fieldtakes place in the n-doped semiconductor zone 13′ or else in thesemiconductor zone 14′. An electric field profile before the correctionby defect-correlated donors is illustrated as curved profile (a). Acorrection of the dopant concentration in the superjunction structure 15by introduction of activation of the defect-correlated donors entailsfor example a change in the electric field profile as in the curvedprofiles (b) and (c). Depending on the correction dose, the profile ofthe electric field can be changed relative to the original field profileto a greater (cf. curve (c)) or less great (cf. curve (b)) extent. Sucha correction of the electric field profile can be performed for exampleduring or after the production of the superjunction transistor structureand be set in a suitable manner with the aid of supportingcharacterization techniques with regard to the electrical properties andalso the reliability of the semiconductor component.

Although specific embodiments have been illustrated and describedherein, it will be appreciated by those of ordinary skill in the artthat a variety of alternate and/or equivalent implementations may besubstituted for the specific embodiments shown and described withoutdeparting from the scope of the present invention. This application isintended to cover any adaptations or variations of the specificembodiments discussed herein. Therefore, it is intended that thisinvention be limited only by the claims and the equivalents thereof.

1. A method for making an integrated circuit including doping asemiconductor body comprising: irradiating a semiconductor body withelectrons in order to produce defects therein; introducing an element orelement compound forming defect-correlated donors and/or acceptors intothe semiconductor body; and activating the defect-correlated donorsand/or acceptors.
 2. The method of claim 1, comprising effecting theactivation of the defect-correlated donors and/or acceptors during theintroduction of the element or element compound formingdefect-correlated donors and/or acceptors by heating the semiconductorbody.
 3. The method of claim 1, comprising effecting the activation ofthe defect-correlated donors and/or acceptors by a process of thermalannealing of the semiconductor body subsequent to the introduction ofthe element or element compound.
 4. The method of claim 1, comprisingeffecting the irradiation of the semiconductor body with electronsbefore the introduction of the element or element compound formingdefect-correlated donors and/or acceptors.
 5. The method of claim 1,comprising effecting the irradiation of the semiconductor body withelectrons after the introduction of the element or element compoundforming defect-correlated donors and/or acceptors.
 6. The method ofclaim 1, comprising effecting the introduction of the element or elementcompound forming defect-correlated donors and/or acceptors by at leastone of the methods from a group consisting of plasma treatment, heattreatment and diffusion from a solid source.
 7. The method of claim 1,comprising applying an electron-shielding mask to the semiconductor bodybefore the irradiation with electrons in order to obtain a localirradiation.
 8. The method of claim 1, comprising effecting after theintroduction of an element or element compound forming defect-correlateddonors and/or acceptors, a process of etching and cleaning of at leastthe surface over which the element or element compound was introduced.9. The method of claim 1, comprising keeping a temperature and/orduration during thermal annealing of the semiconductor body so low thatdefects produced in the semiconductor body remain for reducing aminority carrier lifetime.
 10. The method of claim 1, comprising whereinthe element introduced into the semiconductor body corresponds to atleast one of the elements hydrogen and nitrogen.
 11. The method of claim1, comprising choosing the semiconductor body as a semiconductor bodycomposed of silicon.
 12. The method of claim 11, comprising choosing abasic dopant concentration of the semiconductor body to be less than5×1014 cm-3.
 13. The method of claim 11, comprising choosing a basicdopant concentration of the semiconductor body to be less than 1×1014cm-3.
 14. The method of claim 11, comprising using doses in the range of0.1 to 500 kGy during the irradiation with electrons.
 15. The method ofclaim 11, comprising using energies in the range of 4 MeV to 20 MeVduring the irradiation with electrons.
 16. The method of claim 11,comprising effecting the thermal annealing at temperatures in the rangeof 220° C. to 550° C. over a time period in the range of 15 min to 20 h.17. The method of claim 1, comprising choosing the semiconductor body asa semiconductor composed of gallium arsenide.
 18. A method for doping asemiconductor body composed of silicon comprising: irradiating asemiconductor body with electrons in order to produce defects therein;introducing hydrogen into the semiconductor body; and activating thedefect-correlated donors and/or acceptors.
 19. An integrated circuitcomprising: semiconductor zones formed within a semiconductor body anddefine at least part of the integrated circuit; electricalconnection/driving structures formed outside the semiconductor body;wherein a basic dopant concentration within the semiconductor bodydetermined by defect-correlated donors and/or acceptors.
 20. Theintegrated circuit of claim 19, comprising where a basic dopantconcentration of an n conductivity type within the semiconductor body isdetermined by hydrogen-correlated donors.
 21. The integrated circuit ofclaim 19, comprising where a dopant concentration within at least one ofthe semiconductor zones of the n conductivity type is determined byhydrogen-correlated donors.
 22. The integrated circuit of claim 19,comprising wherein a shortest connection—passing through the at leastone of the semiconductor zones—between a front side and a rear side ofthe semiconductor body only runs through those further semiconductorzones which have a higher dopant concentration in comparison with the atleast one of the semiconductor zones.
 23. An integrated circuitcomprising: semiconductor zones which are formed within a semiconductorbody and define the integrated circuit; electrical connection/drivingstructures formed outside the semiconductor body; and wherein at leastone of the semiconductor zones contains a superjunction structure and adopant concentration within the superjunction structure is at leastpartly determined by defect-correlated donors and/or acceptors.
 24. Theintegrated circuit of claim 23, comprising wherein the integratedcircuit comprises diode, bipolar transistor, MOS transistor,superjunction transistor, IGBT or thyristor.